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3661
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DAD3661

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...
DAW4110
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DAW4110

Fine non-thermal curvilinear cutting Supports other workpiece sizes Cuts workpieces using pressurized water and abrasives Through original technology developed to premix and ...
2310
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DDS2310

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...
dfd6340
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFD6340

Standard dual spindle dicing saw Φ200 mm     Facing dual spindle     DBG     Package Singulation Maximized throughput The DFD6340 features a facing dual-spindle configuration ...
dfd6361
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFD6361

Advanced performance for Φ300 mm dicing Φ300 mm    Facing dual spindle    DBG Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...
DFD6362
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFD6363

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG Compatible with both frame and two-way*(frame/wafer) transferring Various ...
DFD64501
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFD6561

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle Space-saving layout DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
6750
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFD6750

Highly productive dicing saw for precise cutting Supports other workpiece sizes Facing dual spindle Package Singulation Next generation dicing engine featuring dual chuck tables for ...
8640
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFG8640

Pursuing high-precision grinding of various workpieces Φ200 mm 2 axes, 3 chuck tables DBG High-precision grinding High-precision grinding has been required for power devices and ...
dfl_7362
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFL7362

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT
  • DFL7362 is a ...
DP-F05 Series
Product Classification
Consumable No additional charge
  • Consumable No additional charge
DP08
Product Classification
Consumable No additional charge
  • Consumable No additional charge

DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
DTU1550
Product Classification
Peripherals No additional charge
  • Peripherals No additional charge

DTU1550

Next generation water temperature control unit which has improved cooling efficiency and water supply capacity Stable High Precision Processing DTU1550 is a water supply unit for ...
DTU162
Product Classification
Peripherals No additional charge
  • Peripherals No additional charge

DTU162

Higher Dicing quality with lower environmental impact Support for dicing quality The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...
Dwr1720
Product Classification
Peripherals No additional charge
  • Peripherals No additional charge

DWR1720

Deionized Water Recycling Unit A super-compact deionized water recycling unit for advanced environmental performance • Integrates deionized water ...
DWR1722
Product Classification
Peripherals No additional charge
  • Peripherals No additional charge

DWR1722

Ultracompact DI water recycling unit with extraordinary energy and water conservation Numerous functions, ultra compact The DWR1722 is a DI water recycling unit for dicing saws ...
EX-300
Product Classification
Equipment No additional charge
  • Equipment No additional charge

EX-300

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...
FM-22464
Product Classification
Equipment No additional charge
  • Equipment No additional charge

FM-2246 / 2248 /2243

You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...
3343
Product Classification
Equipment No additional charge
  • Equipment No additional charge

FM-3343

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
6648
Product Classification
Equipment No additional charge
  • Equipment No additional charge

FM-6648 / 6643

This model was developed for both pre-cut and normal tape. The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
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