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Disco-DAD3661
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
Disco-DAW4110
Fine non-thermal curvilinear cutting
Supports other workpiece sizes
Cuts workpieces using pressurized water and abrasives
Through original technology developed to premix and ...
Disco-DDS2310
Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for ...
Disco-DFD6340
Standard dual spindle dicing saw
Φ200 mm Facing dual spindle DBG Package Singulation
Maximized throughput
The DFD6340 features a facing dual-spindle configuration ...
Disco-DFD6361
Advanced performance for Φ300 mm dicing
Φ300 mm Facing dual spindle DBG
Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...
Disco-DFD6363
Flagship model for Φ300 mm wafers with high process extensibility
Φ300 mm
Facing dual spindle
DBG
Compatible with both frame and two-way*(frame/wafer) transferring
Various ...
Disco-DFD6561
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
Space-saving layout
DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
Disco-DFD6750
Highly productive dicing saw for precise cutting
Supports other workpiece sizes
Facing dual spindle
Package Singulation
Next generation dicing engine featuring dual chuck tables for ...
Disco-DFG8640
Pursuing high-precision grinding of various workpieces
Φ200 mm
2 axes, 3 chuck tables
DBG
High-precision grinding
High-precision grinding has been required for power devices and ...
Disco-DFL7362
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
- DFL7362 is a ...
DP08 Series
Chemical-free stress relief dry polishing wheel|
In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
DTU1550
Next generation water temperature control unit which has improved cooling efficiency and water supply capacity
Stable High Precision Processing
DTU1550 is a water supply unit for ...
DTU162
Higher Dicing quality with lower environmental impact
Support for dicing quality
The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...
DWR1720
Deionized Water Recycling Unit
A super-compact deionized water recycling unit for advanced environmental performance
• Integrates deionized water ...
DWR1722
Ultracompact DI water recycling unit with extraordinary energy and water conservation
Numerous functions, ultra compact
The DWR1722 is a DI water recycling unit for dicing saws ...
EX-300
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
FM-2246 / 2248 /2243
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
FM-3343
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
FM-6648 / 6643
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
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