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Disco-DFL7362

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Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si

• Φ300 mm • Stealth Dicing™ • SDBG • SDTT

  • DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
  • Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
  • The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.



Product Classification

 

 

 

High throughput

UPH is improved by approx. 30% through increased maximum X-axis speed and acceleration in addition to reduced wafer transfer and alignment times.

 

Wide range of options

DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.

 

 

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.