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DP08 Series
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Chemical-free stress relief dry polishing wheel|
In addition to wafer polishing in the conventional grinding process, the DP08 realizes chemical-free stress relief that can even be used with the DBG process.
The DP08 series enables polishing of ultra-thin wafers with DISCO’s unique dry polishing process. In addition to having a low environmental impact by avoiding the use of chemicals, it achieves high die strength and is simple to operate compared to a process that uses slurry.
In addition to wafer polishing in the conventional grinding process, the DP08 realizes chemical-free stress relief that can even be used with the DBG process.
The DP08 series enables polishing of ultra-thin wafers with DISCO’s unique dry polishing process. In addition to having a low environmental impact by avoiding the use of chemicals, it achieves high die strength and is simple to operate compared to a process that uses slurry.
To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:
- USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
- DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
- FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
- DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
- Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
- READ the operation manual of the cutting/grinding equipment before use.
- DO NOT USE the precision tooling with modified or customized equipment.
- DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
- DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
- Always USE water or coolant to prevent precision tooling damage.
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