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B1A Series
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
Cassette and tape frame
High precision products to facilitate stable production from tape mounter
to die bonder. Meets the ø300 mm wafer SEMI standard.
CC Filter Unit
Unique filter design for low filtration running costs
Designed for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
DAD3220
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness
Φ150 mm
Single spindle
Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing ...
DAD323
World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components
Φ150 mm
Single spindle
Diversified Processes
The DAD323 is a ...
DAD3230
Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis ...
DAD3240
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces
Φ200 mm
Single spindle
High processability
Adoption of a 1.8 kW high-output spindle enables the processing ...
DAD3350
Flexibility for diverse processing needs
Φ200 mm
Single spindle
Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DAD3360
Φ300 mm manual dicer to meet a variety of needs
Φ300 mm
Single spindle
Exceptional processing flexibility
While offering an even more compact footprint than the existing ...
DAD3430
Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
DAD3650
Ultra compact dual-spindle automatic dicing saw
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness ...
DAD3660
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
DAG810
Automatic grinder to respond to new processing needs
Φ200 mm
1 axis, 1 chuck table
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces ...
DAL7020
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
DAS8920
Semi-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface ...
DAS8930
Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DCS1440
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DCS1441
Spin cleaning and drying for workpieces processed using dicing saws
Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and ...