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DAD3220
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness
Φ150 mm
Single spindle
Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing ...
DAD323
World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components
Φ150 mm
Single spindle
Diversified Processes
The DAD323 is a ...
DAD3230
Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis ...
DAD3240
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces
Φ200 mm
Single spindle
High processability
Adoption of a 1.8 kW high-output spindle enables the processing ...
DAD3350
Flexibility for diverse processing needs
Φ200 mm
Single spindle
Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DAD3360
Φ300 mm manual dicer to meet a variety of needs
Φ300 mm
Single spindle
Exceptional processing flexibility
While offering an even more compact footprint than the existing ...
DAD3430
Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
DAD3650
Ultra compact dual-spindle automatic dicing saw
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness ...
DAD3660
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
DFD6240
Among the world’s smallest fully automatic dicing saws
Φ200 mm Single spindle
Factory-friendly design
By optimizing the frame structure and handling section layout, the ...
DFD6341
Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field
Φ200 mm Facing dual ...
DFD6362
Dicing saw for improved productivity with Φ300 mm wafers
Φ300 mm Facing dual spindle
Realizes further productivity improvement with various new functions
DFD6362 offers a ...
DFD6450
Fully automatic dicing saw with parallel dual spindles
Φ200 mm
Parallel dual spindle
Package Singulation
A parallel dual design unique to DISCO
Featuring parallel dual-spindles, ...
DFD6560
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
16% reduced footprint
DFD6560 is equipped with uniquely developed short spindles and an optimized ...
DFD6760
High end dicing saw for Φ300 mm wafers
Φ300 mm
Facing dual spindle
Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced ...
Disco-DAD3221
Evolved Compact Dicing Saw
Φ150 mm
Single spindle
Compatible with Diverse Small Workpiece Processing Needs
DAD3221 is a single-axis dicing saw which achieves processing of ...
Disco-DAD3231
Evolved Compact Dicing Saw
Φ150 mm
Single spindle
Focus on Functionality and Expandability
DAD3231, designed for high performance and expandability, just like the conventional ...
Disco-DAD324
Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality
Φ150 mm
Single spindle
Support for a variety of applications from semiconductor wafers to ...
Disco-DAD3241
Standard manual dicing saw for Φ8-inch workpieces
Φ200 mm
Single spindle
High processability
Improved throughput through the introduction of servo motors on all axes (X, Y, and ...
Disco-DAD3361
Highly expandability to support various processing needs
Φ300 mm
Single spindle
Supports a wide range of applications
DAD3361 is a semi-automatic dicing saw capable of handling ...