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StayClean Injector
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
StayClean-A
Prevents particle adhesion during dicing
Cutting water additive to prevent particle adhesion
Particle adhesion is a ...
StayClean-F
Prevents pad corrosion during dicing
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
StayClean-R
Conserving Water While Preventing Corrosion
Prevents Corrosionby DI water
The active component in StayClean-R continuously ...
Super Bubbler Wac
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
TEX-218G
TEX-218G for up to GR-8
The TEX series is adopted air cylinder for expansion stage operation. It makes
equipment component become simple and realized easy maintenance.
TM11 Series
Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
UltraPoligrind
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Ultrasonic-wave dicing unit
Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
UVB-608i for up to 8"
Black-light type UVB-608i
UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for
exceptional cost-performance value.
UVC-300
Model: UVC-300A for up to 12”
UV-LED models which have a long life and low running cost are
cassette to cassette fully automatic system and 200mm (8”) manual
and 300mm (12”)
UVC-408 for 8”
High- pressure Mercury lamp models which have perfect UV curing
performances is 200mm (8”) manual and 300mm (12”) manual
system.
VT07/12 Series
Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
Z05 Series
Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
The Z05 Series offers ultra-high cutting performance for a wide range of ...
Z09 Series
Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
The Z09 series adopts a newly developed high strength bond and meets ...
ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
ZHCR Series
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
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