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Ultrasonic-wave dicing unit
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Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing quality and high-speed dicing of difficult-to-cut materials as typified by SiC (silicon carbide), glass and alumina ceramics.
Features of ultrasonic-wave processing
Transmitting ultrasonic-wave oscillations to the blade improves water circulation at the processing point (elimination of clogging caused by the cutting dust discharge effect and cooling of the processing point) and promotes self-sharpening of the blade (elimination of blade glazing). Thus, normal blade conditions can be maintained and process load can be reduced making highly efficient dicing possible.
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing quality and high-speed dicing of difficult-to-cut materials as typified by SiC (silicon carbide), glass and alumina ceramics.
Features of ultrasonic-wave processing
Transmitting ultrasonic-wave oscillations to the blade improves water circulation at the processing point (elimination of clogging caused by the cutting dust discharge effect and cooling of the processing point) and promotes self-sharpening of the blade (elimination of blade glazing). Thus, normal blade conditions can be maintained and process load can be reduced making highly efficient dicing possible.
Blade edge movement
Ultrasonic-wave oscillation mechanism
Retrofit available
Since this unit can be retrofitted to already shipped dicing saws, introducing ultrasonic-wave applications to your production line is a simple process. In addition, normal blades can be used even after the retrofit.
Unit configuration
- Ultrasonic-wave amplitude generation power unit
- Dedicated mount and blade
- Ultrasonic-wave oscillation measurement sensor
- Software
Blade for ultrasonic-wave dicing unit
U09SERIES
Specification
