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DAD3350
Flexibility for diverse processing needs
Φ200 mm
Single spindle
Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DAD3240
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces
Φ200 mm
Single spindle
High processability
Adoption of a 1.8 kW high-output spindle enables the processing ...
DAD3230
Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis ...
DAD323
World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components
Φ150 mm
Single spindle
Diversified Processes
The DAD323 is a ...
DAD3220
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness
Φ150 mm
Single spindle
Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
CC Filter Unit
Unique filter design for low filtration running costs
Designed for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
Cassette and tape frame
High precision products to facilitate stable production from tape mounter
to die bonder. Meets the ø300 mm wafer SEMI standard.
Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
B1A Series
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Metal bond Applications: Electronics components, Optical devices, Various types of ...
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