Experimental Data

TEM comparison of wafer damage

The damaged layer of a wafer ground using UltraPoligrind is extremely small compared to that of a wafer ground using a #2000 grinding wheel.

Die strength comparison (Ball bending)

Gettering effects

The amount of precipitated Cu detected on the polished surface of a mirror wafer exceeds 1.0 E11 after a copper solution was applied to the surface. In contrast, the amount of precipitated Cu detected on the backside of a wafer polished with Gettering DP is below the detection limit, thus indicating that the surface had a gettering effect.

TXRF measurement data before and after Cu solution application (Φ8” mirror wafer）

To quantitatively measure the gettering effects, samples were contaminated with a Cu solution. The Cu was diffused at 350°C for 3 hours and then analyzed using TXRF (Total-Reflection X-ray Fluorescence). The observed Cu on the surface of the respective wafers is as seen below.

※ Detectable range at below 0.5E10 atoms/cm²

Specification:

Assistance with using Poligrind

To achieve the best processing results possible with Poligrind, correct formulation of the application is required. DISCO’s applications engineers will be happy to work with your workpiece and specifications to achieve the desired processing results

Precision Processing Tools Process Correlation Chart and Trouble Support

When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.

To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:

• USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
• DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
• FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
• DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
• Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
• READ the operation manual of the cutting/grinding equipment before use.
• DO NOT USE the precision tooling with modified or customized equipment.
• DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
• DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
• Always USE water or coolant to prevent precision tooling damage.