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Advanced performance for Φ300 mm dicing Φ300 mm Facing dual spindle DBG Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...

Disco-DFD6340

Standard dual spindle dicing saw Φ200 mm Facing dual spindle DBG Package Singulation Maximized throughput The DFD6340 features a facing dual-spindle configuration ...

Disco-DDS2310

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...

Disco-DAW4110

Fine non-thermal curvilinear cutting Supports other workpiece sizes Cuts workpieces using pressurized water and abrasives Through original technology developed to premix and ...

Disco-DAD3661

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Disco-DAD3651

Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3651 combines high ...

Disco-DAD3431

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...

Disco-DAD3361

Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...

Disco-DAD3241

Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...

Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality Φ150 mm Single spindle Support for a variety of applications from semiconductor wafers to ...

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Disco-DAD3231

Evolved Compact Dicing Saw Φ150 mm Single spindle Focus on Functionality and Expandability DAD3231, designed for high performance and expandability, just like the conventional ...

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Disco-DAD3221

Evolved Compact Dicing Saw Φ150 mm Single spindle Compatible with Diverse Small Workpiece Processing Needs DAD3221 is a single-axis dicing saw which achieves processing of ...

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DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...

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DFS8960

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

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DFS8910

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

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DFP8160

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

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DFP8140

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

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DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...

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DFL7560L

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off
Laser Lift-off is a technology used to detach the material layer from the ...

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DFL7361

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...