Stable processing quality
By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved. In addition, a temperature monitoring function that utilizes a spindle temperature sensor has been installed.

Processing Time Reduction
Processing time is decreased up to 2% compared to the existing equipment through axis-speed improvement by adopting servo motors for all axes and optimizing the control parameters.

Improved functions and operation
The high-speed, high-accuracy NCS (Non-Contact Setup, optional) reduces blade height measurement time for the processing table by 74%. Further processing quality stabilization is achieved through improved measurement accuracy. In addition, the visibility during kerf check was improved by enabling microscope ring light three-channel switching. This model supports SECS/GEM.

Easy operation

• XIS (Extended Interface System)
  Operation buttons consolidated on microscope screens
• Wafer mapping
  Graphic processing condition display similar to full automation equipment.
• Log viewer
  Graphic analog data display and equipment data visualization
• Help viewer
  Displays instructions when error occurs for quick, accurate recovery.

High maintainability

• Enhancement of Dust Prevention Performance on X-, Y-, and Z-axes.
  Effective for materials including ceramics where contamination is likely to damage the shaft.

Multi-mounted workpiece processing
Allows multiple package substrates to be attached to one tape frame for processing (Maximum: 16 workpieces).

 

 

Measurement alignment
Enables highly accurate processing by performing multiple point alignments for materials with irregular expansion and contraction including resin substrates.

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.