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Advanced handling systems and design features facilitate high yield for thin wafer grinding.
The DFP8140/8160‘s design allows it to be integrated with DISCO grinders for an in-line wafer thinning solution that grinds, dry polishes, and transports wafers safely and securely (the in-line system requires the installation of optional accessories).
Unlike chemical etching or CMP, the dry polishing process does not require costly waste treatment and disposal. Dry polishing with the DFP8140/8160 is environmentally friendly while maintaining a lower cost of ownership than other stress relief processes.
Supports the same proven technology of DISCO’s 800-series grinding wheels, spindles, chuck tables and dresser boards.
The DFP8140/8160 utilizes the same operator interface and machine layout as the DISCO Fully Automatic Grinder (DFG8540/8560). This ensures reduced training time for operators familiar with DISCO
equipment. For those new to the 8000 Series, the touch-screen graphical user interface with real-time process data makes both operation and maintenance tasks easy to learn and accomplish.