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The planarization process reduces Au bump height variation and stress (temperature and load) when bonding Au-Au interfaces for use in next generation SiP solutions.
Variations in resin thickness of the LED emission unit is the cause of color irregularities. Planarization of the resin and bumps with high accuracy using a diamond bit can contribute towards the stabilization of LED color emissions.
Backgrinding of wafers with large bumps can result in high wafer thickness variation. The final wafer surface thickness variation can be reduced by tape planarization prior to grinding.
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.