DAD3660

Support for multiply mounted packaging substrates
The DAD3360 can process multiple packaging substrates mounted on the same tape frame. This improves productivity through a reduction in the workpiece replacement time and dicing tape costs.

Improved throughput
With dual cut, a cutting mode where the dicer performs dicing with both spindles at the same time, throughput can be improved by up to 90% compared to conventional equipment (DAD3350, single axis dicer with Φ300 mm support as a user-specified specification).

Stabilization of processing quality
By selecting the sub-chuck table specification, blade dress is possible during processing (supports full size dresser boards, 75 x 75 mm). This mid-process blade dress can help to stabilize process quality when processing hard and brittle materials, such as glass substrates, and ductile materials, including resin and metal, which often cause blade loading.

High-load Processing
By selecting the high torque and rigidity 2.2 kW spindle, high load processing, including the grooving of hard and brittle materials, such as glass or ceramics, and grooving using thick blades can be supported.

Easy operation

• User friendly
  A 19-inch large monitor and large buttons provide ease of use.
• Condition monitoring functions
  Monitoring of utilities, spindle current and more
• Auto-alignment
  By performing teach (procedure to register the cutting position) in advance for each device, auto-alignment is possible by only selecting the device data.
• Kerf checking
  Automatic measurement of cut line deviations and kerf width to manage cut quality.

Efficient use of space
Auxiliary equipment (UPS, transformer for use outside of Japan, CO2 injector, booster pump unit) has typically been external, but the DAD3660 allows many of these units to be installed internally to save space.

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.