Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc
UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding ...
Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 ...
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels ...
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond
Applications: Electronics components, Optical devices, Various types of ...
Electroformed hub blades producing high quality substrate dicing
Electroformed bond
Applications: Chip LED board, Various types of semiconductor packages, etc
The ZHDG series developed for ...
Ultrathin hub blades for stable dicing of narrow street wafers
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc
ZHZZ series hub blades were ...