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b1_a
b1
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B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
DAL7020
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DAL7020

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...
DFL7020
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DFL7020

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...
DFL7160
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DFL7160

Supports various applications, including full cut and DAF cut Φ300 mm Ablation
  • DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...
DFL7161
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DFL7161

High-quality, high-throughput standard laser grooving model Φ300 mm Ablation
  • DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...
gf01_series
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GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
GF136
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GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
IF_SERIES
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IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
nbc-zh
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NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
p1a_series
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P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
IF_SERIES
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Poligrind

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
z05_2
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R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
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