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B1A Series
Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
Metal bond Applications: Electronics components, Optical devices, Various types of ...
GF01 SERIES
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
GF13 Series
GRINDING WHEELS
Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
•Supports SDBG ...
IF SERIES
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
P1A Series
With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Poligrind
Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
R07 Series
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
TM11 Series
Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
UltraPoligrind
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
VT07/12 Series
Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
Z05 Series
Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
The Z05 Series offers ultra-high cutting performance for a wide range of ...
Z09 Series
Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
The Z09 series adopts a newly developed high strength bond and meets ...
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- +63 908 887 4217
- +63 998 961 9440
- info@aurotech.com
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