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ZP07 Series

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High grade processing is possible with an electroplated porous structure blade

The ZP07 series realizes high-grade processing of hard materials and compound materials by employing a porous structure inside an electroplated blade
The ZP07 series combines high cutting ability that is specific to electroplated bond blades and appropriate self sharpening ability by forming pores in the electroplated bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult-to-cut using the conventional electroplated bond.

- Realizes one-pass processing of glass + silicon wafer.
- Realizes high-quality processing of silicon carbide (SiC) and other difficult to-cut materials.
- Two types are available: Standard and low concentration.



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To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:

  • USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
  • DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
  • FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
  • DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
  • Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
  • READ the operation manual of the cutting/grinding equipment before use.
  • DO NOT USE the precision tooling with modified or customized equipment.
  • DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
  • DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
  • Always USE water or coolant to prevent precision tooling damage.