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GF13 Series

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GRINDING WHEELS

Improved productivity and grinding quality Grinding wheel for semiconductor wafer

•Supports SDBG processing




Product Classification

 

To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:

  • USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
  • DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
  • FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
  • DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
  • Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
  • READ the operation manual of the cutting/grinding equipment before use.
  • DO NOT USE the precision tooling with modified or customized equipment.
  • DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
  • DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
  • Always USE water or coolant to prevent precision tooling damage.