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gf01_series
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GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
GF136
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GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
IF_SERIES
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IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
nbc-zh
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NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
IF_SERIES
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Poligrind

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
ultra
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UltraPoligrind

Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
ZH05SERIES
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ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14SERIES
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ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...
zhcrseries
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ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...
zhdg1
zhdg2
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ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHFX1_SERIES
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ZHFX Series

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...
ZHRF
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ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...
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