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Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...

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CO 2 Injector

High quality processing through direct link to dicing saw Workpiece charging significantly reduced The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...

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TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...

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ZP07 Series

High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...

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B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...

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Z09 Series

Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...

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R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...

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StayClean-A

Prevents particle adhesion during dicing Cutting water additive to prevent particle adhesion Particle adhesion is a ...

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DCS1460

Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...

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DCS1440

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...

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DTU1550

Next generation water temperature control unit which has improved cooling efficiency and water supply capacity Stable High Precision Processing DTU1550 is a water supply unit for ...

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StayClean Injector

Dedicated unit for injecting StayClean into cutting water Highly accurate dilution control to ratios as low as 1:10,000. • Automatic bottle replacement enables continuous ...

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DWR1722

Ultracompact DI water recycling unit with extraordinary energy and water conservation Numerous functions, ultra compact The DWR1722 is a DI water recycling unit for dicing saws ...

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Ultrasonic-wave dicing unit

Realizes high quality and high speed processing of difficult-to-cut materials Targets for ultrasonic-wave processing Ultrasonic-wave processing aims to achieve good processing ...

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Blade breakage sensor

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

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Non contact setup

Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.

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StayClean-R

Conserving Water While Preventing Corrosion Prevents Corrosionby DI water The active component in StayClean-R continuously ...

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StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...

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Z05 Series

Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...

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ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...