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DAG810
Product Classification
Equipment No additional charge
  • Equipment No additional charge

DAG810

Automatic grinder to respond to new processing needs Φ200 mm 1 axis, 1 chuck table Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces ...
DFG8340
Product Classification
Equipment No additional charge
  • Equipment No additional charge

DFG8340

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...
DFG8540
Product Classification
Equipment No additional charge
  • Equipment No additional charge

DFG8540

Supports advancements for thinner wafers Φ200 mm 2 axes, 3 chuck tables Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield ...
DFG8560
Product Classification
Equipment No additional charge
  • Equipment No additional charge

DFG8560

Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is ...
DFG8830
Product Classification
Equipment No additional charge
  • Equipment No additional charge

DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
8761
Product Classification
Equipment No additional charge
  • Equipment No additional charge

DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
8640
Product Classification
Equipment No additional charge
  • Equipment No additional charge

Disco-DFG8640

Pursuing high-precision grinding of various workpieces Φ200 mm 2 axes, 3 chuck tables DBG High-precision grinding High-precision grinding has been required for power devices and ...
DP-F05 Series
Product Classification
Consumable No additional charge
  • Consumable No additional charge
DP08
Product Classification
Consumable No additional charge
  • Consumable No additional charge

DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Gettering DP1
Product Classification
Consumable No additional charge
  • Consumable No additional charge

Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...

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