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DFP8140
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Chemical-and slurry-free stress relief
Improved yield
Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes the grinding induced damage layer by utilizing a dry polishing process. This process greatly reduces warpage and the chance of wafer breakage while improving die strength. The end result is superior product yield, even for today's ultra thin wafers.
Improved yield
Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes the grinding induced damage layer by utilizing a dry polishing process. This process greatly reduces warpage and the chance of wafer breakage while improving die strength. The end result is superior product yield, even for today's ultra thin wafers.
In-line system
Advanced handling systems and design features facilitate high yield for thin wafer grinding.
Design flexibility
The DFP8140/8160‘s design allows it to be integrated with DISCO grinders for an in-line wafer thinning solution that grinds, dry polishes, and transports wafers safely and securely (the in-line system requires the installation of optional accessories).
Environmentally friendly process
Unlike chemical etching or CMP, the dry polishing process does not require costly waste treatment and disposal. Dry polishing with the DFP8140/8160 is environmentally friendly while maintaining a lower cost of ownership than other stress relief processes.
Backward-compatibility
Supports the same proven technology of DISCO’s 800-series grinding wheels, spindles, chuck tables and dresser boards.
Easy operation
The DFP8140/8160 utilizes the same operator interface and machine layout as the DISCO Fully Automatic Grinder (DFG8540/8560). This ensures reduced training time for operators familiar with DISCO
equipment. For those new to the 8000 Series, the touch-screen graphical user interface with real-time process data makes both operation and maintenance tasks easy to learn and accomplish.
Environmental Conditions:
- Use clean, oil-free air (dew point between -10 - -20 , residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
- Keep room temperature fluctuations within ±1℃ of the set value. (Set value should be between 20 - 25 ℃).
- Keep cutting water and cleaning water 2 ℃ above room temperature (fluctuations within ±1 ℃).
- The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
- This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
- All pressures specified above are gauge pressures.
- As the above specification may change due to technical modifications. Please confirm when placing your order.
- For further information, please contact your local sales representative.