Among the world’s smallest fully automatic dicing saws Φ200 mm       Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the ...

Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field Φ200 mm   Facing dual ...

Dicing saw for improved productivity with Φ300 mm wafers Φ300 mm     Facing dual spindle Realizes further productivity improvement with various new functions DFD6362 offers a ...

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized ...

High end dicing saw for Φ300 mm wafers Φ300 mm Facing dual spindle Fully automatic dicing saw with dual chuck tables DFD6760 is a high end model which has further enhanced ...

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

Standard dual spindle dicing saw Φ200 mm     Facing dual spindle     DBG     Package Singulation Maximized throughput The DFD6340 features a facing dual-spindle configuration ...

Advanced performance for Φ300 mm dicing Φ300 mm    Facing dual spindle    DBG Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG Compatible with both frame and two-way*(frame/wafer) transferring Various ...