Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...