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DAL7020
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DAL7020

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...
DFL7020
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DFL7020

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...
DFL7160
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DFL7160

Supports various applications, including full cut and DAF cut Φ300 mm Ablation
  • DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...
DFL7161
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DFL7161

High-quality, high-throughput standard laser grooving model Φ300 mm Ablation
  • DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...
DFP1402
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DFP8140

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
DFG8560
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DFP8160

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

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