Unique filter design for low filtration running costs Designed for use next to a dicing saw Ultra-small footprint filtration system This unit recycles dicing/grinding water and ...

HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...

Spin cleaning and drying for workpieces processed using dicing saws Manual cleaning system with enhanced cleaning performance The DCS1441 is the optimal solution for cleaning and ...

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Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...

Pursuing high-precision grinding of various workpieces Φ200 mm 2 axes, 3 chuck tables DBG High-precision grinding High-precision grinding has been required for power devices and ...

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...

Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...

Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...