Disco-DDS2310
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Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for wafers with a modified layer formed through Stealth Dicing™ process. This equipment is effective for small die after Stealth Dicing™ process.
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for wafers with a modified layer formed through Stealth Dicing™ process. This equipment is effective for small die after Stealth Dicing™ process.
Maintains a sufficient and constant kerf width
By installing FIR (Far Infrared) heaters and a heater expansion table developed for small-die separation, a sufficient kerf width for small die can be maintained.
Improves productivity through the installation of four FIR heaters as a standard feature
The installation of four FIR heaters improves the tape shrink performance and UPH for separation of small die.
Cool expansion increases DAF separation quality
The cool expansion method is used to achieve stable DAF cleaving. Using the characteristics of DAF where it becomes brittle at low temperatures, expansion is performed in a low temperature environment to realize high precision DAF separation.
Tape frame transport moves the workpiece smoothly to the next process.
The sagging that occurs around the periphery of the dicing tape after expansion can be eliminated through heat shrinking. This enables the workpiece to be transported to the following die bonding process, while it is still mounted on a tape frame and eliminates the need to replace the tape.
Application examples
- Die separation after Stealth Dicing™ process
- DAF separation after DBG/SDBG
- DAF separation after blade dicing
Work Flow System
- The push-pull arm retrieves the workpiece from the cassette and transfers it to the frame centering stage. →
- The workpiece is aligned on the frame centering stage, then transferred to the intermediate stage. →
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The workpiece is transferred to the cooler expansion stage, and cool expansion is performed. →
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The workpiece is transferred to the heater expansion stage, and re-expansion and heat shrinking are performed. →
- The workpiece is transferred to the spinner stage, where it is cleaned and dried. →
- The workpiece is transferred to the UV irradiation stage (optional accessory) and UV irradiation is performed. →
- The push-pull arm returns the workpiece to the cassette.
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.