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Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
CC Filter Unit
Unique filter design for low filtration running costs
Designed for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
CO 2 Injector
High quality processing through direct link to dicing saw
Workpiece charging significantly reduced
The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
DCS1440
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DCS1441
Spin cleaning and drying for workpieces processed using dicing saws
Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and ...
DCS1460
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DFL7341
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm Stealth Dicing™ SDBG SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7361
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7560L
Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser
Φ150 mm
Laser Lift-off
- Laser Lift-off is a technology used to detach the material layer from the ...
DFP8140
Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
DFP8160
Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...
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