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DFL7341
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Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm Stealth Dicing™ SDBG SDTT
Φ200 mm Stealth Dicing™ SDBG SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
- Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
- This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.
Height adjustment function
Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage.
Wafer shape recognition
Wafer shape is measured using a high-resolution sensor to singulate at the optimal processing area.
Compatibility with various materials
High-quality processing can be achieved for sapphire, SiC, and GaAs using laser oscillators suited for each material.
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.