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DDS2010
High yield and high throughput separation of small die processed with Stealth Dicing™
Φ200 mm
SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated ...
DDS2300
Die separator for high-precision DAF separation
Φ300 mm
SDBG
SDTT
Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach ...
DFL7341
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm Stealth Dicing™ SDBG SDTT
- DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7361
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
DFL7560L
Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser
Φ150 mm
Laser Lift-off
- Laser Lift-off is a technology used to detach the material layer from the ...
Disco-DAW4110
Fine non-thermal curvilinear cutting
Supports other workpiece sizes
Cuts workpieces using pressurized water and abrasives
Through original technology developed to premix and ...
Disco-DDS2310
Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for ...
Disco-DFL7362
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
- DFL7362 is a ...
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