Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...

“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...