Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

High-quality, high-throughput standard laser grooving model Φ300 mm Ablation

• DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...

“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...