High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard materials and compound materials by employing a porous structure inside an electroplated blade
The ZP07 series combines high cutting ability that is specific to electroplated bond blades and appropriate self sharpening ability by forming pores in the electroplated bond. It is now possible to process silicon + glass, silicon carbide (SiC) and other materials that have been difficult-to-cut using the conventional electroplated bond.
- Realizes one-pass processing of glass + silicon wafer.
- Realizes high-quality processing of silicon carbide (SiC) and other difficult to-cut materials.
- Two types are available: Standard and low concentration.