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The following Z3 spindle configurations for thin wafer processing can be selected:
*Gettering: a process which forms a minute destructive layer (gettering sites) inside the silicon wafer. Impurities, such as heavy metals, present in the wafer are captured at these gettering sites.
This is a solution which realizes high die strength and maintains the gettering effect by using DISCO’s unique dry polishing.
The newly developed UltraPoligrind wheel, which uses micro-abrasives, can process thin wafers without chemicals. The wheel can achieve high wafer strength which cannot be obtained with traditional grinding wheels, while maintaining the grinding gettering effect (Extrinsic Gettering).
By integrating the DGP8761 with a multi-wafer mounter, DFM2800, it is possible to support the attachment of DAF (Die Attach Film) for thin wafers. It can also be used in an inline configuration with DISCO's DBG (Dicing Before Grinding) process.
The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI (Graphical User Interface) are based on proven 8000 Series technology.
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.