“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole production process from material design to final inspection. Everything takes place within state-of-the-art clean room production environments with strict quality controls in place every step of the way. The result is ICROS™ Tape, an ultraclean tape with superior TTV (total thickness variation). Today, ICROS™ Tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow, such as dicing, and packaging process.”

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