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b1_a
b1
Product Classification

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
disco_DFD6240
Product Classification

DFD6240

Among the world’s smallest fully automatic dicing saws Φ200 mm       Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the ...
DISCO-DFD6341
Product Classification

DFD6341

Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field Φ200 mm   Facing dual ...
DFD6362
Product Classification

DFD6362

Dicing saw for improved productivity with Φ300 mm wafers Φ300 mm     Facing dual spindle Realizes further productivity improvement with various new functions DFD6362 offers a ...
DFD6450
Product Classification

DFD6450

Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation A parallel dual design unique to DISCO Featuring parallel dual-spindles, ...
DFD64501
Product Classification

DFD6560

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized ...
DFD6760
Product Classification

DFD6760

High end dicing saw for Φ300 mm wafers Φ300 mm Facing dual spindle Fully automatic dicing saw with dual chuck tables DFD6760 is a high end model which has further enhanced ...
dfd6340
Product Classification

Disco-DFD6340

Standard dual spindle dicing saw Φ200 mm     Facing dual spindle     DBG     Package Singulation Maximized throughput The DFD6340 features a facing dual-spindle configuration ...
dfd6361
Product Classification

Disco-DFD6361

Advanced performance for Φ300 mm dicing Φ300 mm    Facing dual spindle    DBG Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...
DFD6362
Product Classification

Disco-DFD6363

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG Compatible with both frame and two-way*(frame/wafer) transferring Various ...
DFD64501
Product Classification

Disco-DFD6561

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle Space-saving layout DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
6750
Product Classification

Disco-DFD6750

Highly productive dicing saw for precise cutting Supports other workpiece sizes Facing dual spindle Package Singulation Next generation dicing engine featuring dual chuck tables for ...
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