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b1_a
b1
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Consumable No additional charge
  • Consumable No additional charge

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
grip ring3
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Consumable No additional charge
  • Consumable No additional charge

Grip Ring

A reinforced plastic double grip rings are consist of inner and outer rings.
nbc-zh
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Consumable No additional charge
  • Consumable No additional charge

NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
p1a_series
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Product Classification
Consumable No additional charge
  • Consumable No additional charge

P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
z05_2
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Consumable No additional charge
  • Consumable No additional charge

R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
tm11series
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Consumable No additional charge
  • Consumable No additional charge

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
VT07_12SERIES
VT07_12SERIES_1
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Product Classification
Consumable No additional charge
  • Consumable No additional charge

VT07/12 Series

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
z05_1
z05_2
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Product Classification
Consumable No additional charge
  • Consumable No additional charge

Z05 Series

Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
z09
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Product Classification
Consumable No additional charge
  • Consumable No additional charge

Z09 Series

Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
ZH05SERIES
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Product Classification
Consumable No additional charge
  • Consumable No additional charge

ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14SERIES
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Consumable No additional charge
  • Consumable No additional charge

ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...
zhcrseries
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Consumable No additional charge
  • Consumable No additional charge

ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...
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