Standard dual spindle dicing saw
Φ200 mm Facing dual spindle DBG Package Singulation
Maximized throughput
The DFD6340 features a facing dual-spindle configuration ...
Advanced performance for Φ300 mm dicing
Φ300 mm Facing dual spindle DBG
Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...
Flagship model for Φ300 mm wafers with high process extensibility
Φ300 mm
Facing dual spindle
DBG
Compatible with both frame and two-way*(frame/wafer) transferring
Various ...
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
Space-saving layout
DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...
With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond
Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond
Applications: Glass, Quartz, Ceramics, etc
A bond material optimal for the characteristics ...