Pursuing high-precision grinding of various workpieces
Φ200 mm
2 axes, 3 chuck tables
DBG
High-precision grinding
High-precision grinding has been required for power devices and ...
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
Next generation water temperature control unit which has improved cooling efficiency and water supply capacityStable High Precision Processing
DTU1550 is a water supply unit for ...
Higher Dicing quality with lower environmental impactSupport for dicing quality
The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...
Ultracompact DI water recycling unit with extraordinary energy and water conservationNumerous functions, ultra compact
The DWR1722 is a DI water recycling unit for dicing saws ...
EX Series
Model:
EX-300 for Gr-12
The EX series is an adopted motor drive for expansion stage operation.
Expansion stroke and expansion speed can be controlled numerically.
And film auto-cut function is equipped ...
You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production.
This manual wafer mounter series supports three different sizes of ...
This wafer mounter is ideal for diversified tape application and lamination conditions.
This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...
This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the ...
FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work.
Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...
Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc
Due to the ultra-thinning of wafers, loss of gettering performance ...
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels ...
HogoMax Series
Water-soluble protective film for laser processing
Highly purified water-soluble protective film for semiconductor processes
- HogoMax is a water-soluble resin that prevents particles from ...
“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...