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ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
ZHCR Series
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
ZHFX Series
Achieves continuous, high-quality processing of oxide wafers
Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for ...
ZHZZ Series
Ultrathin hub blades for stable dicing of narrow street wafers
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc
ZHZZ series hub blades were ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Z05 Series
Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
The Z05 Series offers ultra-high cutting performance for a wide range of ...
StayClean-F
Prevents pad corrosion during dicing
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
StayClean-R
Conserving Water While Preventing Corrosion
Prevents Corrosionby DI water
The active component in StayClean-R continuously ...
Non contact setup
Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
Blade breakage sensor
Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.
Ultrasonic-wave dicing unit
Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
DWR1722
Ultracompact DI water recycling unit with extraordinary energy and water conservation
Numerous functions, ultra compact
The DWR1722 is a DI water recycling unit for dicing saws ...
StayClean Injector
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
DTU1550
Next generation water temperature control unit which has improved cooling efficiency and water supply capacity
Stable High Precision Processing
DTU1550 is a water supply unit for ...
DCS1440
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DCS1460
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
StayClean-A
Prevents particle adhesion during dicing
Cutting water additive to prevent particle adhesion
Particle adhesion is a ...
R07 Series
Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
Z09 Series
Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
The Z09 series adopts a newly developed high strength bond and meets ...