Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

High-quality, high-throughput standard laser grooving model Φ300 mm Ablation

• DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide ...

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT

• DFL7341 is a fully automatic laser saw for Φ8-inch ...

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off

• Laser Lift-off is a technology used to detach the material layer from the ...

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT

• DFL7362 is a ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...