Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Supports various applications, including full cut and DAF cut Φ300 mm Ablation

• DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT

• DFL7341 is a fully automatic laser saw for Φ8-inch ...

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT

• DFL7362 is a ...

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...

TEX-218G for up to GR-8 The TEX series is adopted air cylinder for expansion stage operation. It makes equipment component become simple and realized easy maintenance.