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DFL7341
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DFL7341

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT
  • DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
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DFL7360FH

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7361
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DFL7361

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7560L
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DFL7560L

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off
  • Laser Lift-off is a technology used to detach the material layer from the ...
dfl_7362
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Disco-DFL7362

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT
  • DFL7362 is a ...
EX-300
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EX-300

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...
gf01_series
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GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
GF136
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GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
IF_SERIES
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IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
IF_SERIES
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Poligrind

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
TEX-218G
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TEX-218G

TEX-218G for up to GR-8 The TEX series is adopted air cylinder for expansion stage operation. It makes equipment component become simple and realized easy maintenance.

ultra
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UltraPoligrind

Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...

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