Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels ...
“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding ...
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc
Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc
UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
Electroformed hub blades producing high quality substrate dicing
Electroformed bond
Applications: Chip LED board, Various types of semiconductor packages, etc
The ZHDG series developed for ...
Achieves continuous, high-quality processing of oxide wafers
Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for ...