High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...

Among the world’s smallest fully automatic dicing saws Φ200 mm       Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the ...

Dicing saw for improved productivity with Φ300 mm wafers Φ300 mm     Facing dual spindle Realizes further productivity improvement with various new functions DFD6362 offers a ...

Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation A parallel dual design unique to DISCO Featuring parallel dual-spindles, ...

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized ...

Fine non-thermal curvilinear cutting Supports other workpiece sizes Cuts workpieces using pressurized water and abrasives Through original technology developed to premix and ...

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...

Standard dual spindle dicing saw Φ200 mm     Facing dual spindle     DBG     Package Singulation Maximized throughput The DFD6340 features a facing dual-spindle configuration ...