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ZHRF
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ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...
3661
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Disco-DAD3661

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...
3651
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Disco-DAD3651

Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3651 combines high ...
3431
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Disco-DAD3431

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...
3361
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Disco-DAD3361

Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...
dfd3241
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Disco-DAD3241

Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...
DAD3230
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Disco-DAD3231

Evolved Compact Dicing Saw Φ150 mm Single spindle Focus on Functionality and Expandability DAD3231, designed for high performance and expandability, just like the conventional ...
3221
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Disco-DAD3221

Evolved Compact Dicing Saw Φ150 mm Single spindle Compatible with Diverse Small Workpiece Processing Needs DAD3221 is a single-axis dicing saw which achieves processing of ...
dad324
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Disco-DAD324

Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality Φ150 mm Single spindle Support for a variety of applications from semiconductor wafers to ...
zhdg1
zhdg2
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ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHFX1_SERIES
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ZHZZ Series

Ultrathin hub blades for stable dicing of narrow street wafers Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc ZHZZ series hub blades were ...
ZHFX1_SERIES
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ZHFX Series

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...
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