Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Supports various applications, including full cut and DAF cut Φ300 mm Ablation

• DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT

• DFL7341 is a fully automatic laser saw for Φ8-inch ...

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...