Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...

Offering improved productivity of fully automatic dual spindle dicing saws by introducing measures to increase throughput with proven records in the field Φ200 mm   Facing dual ...

Dicing saw for improved productivity with Φ300 mm wafers Φ300 mm     Facing dual spindle Realizes further productivity improvement with various new functions DFD6362 offers a ...

Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation A parallel dual design unique to DISCO Featuring parallel dual-spindles, ...

High end dicing saw for Φ300 mm wafers Φ300 mm Facing dual spindle Fully automatic dicing saw with dual chuck tables DFD6760 is a high end model which has further enhanced ...

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...

Supports advancements for thinner wafers Φ200 mm 2 axes, 3 chuck tables Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield ...