DFG8540
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Supports advancements for thinner wafers
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield for thin wafer grinding.
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield for thin wafer grinding.
Design flexibility
The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions.
Inherited grinding specifications with an established reputation
DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.2 t (28% less than DFG850) while maintaining the same basic specifications and performance level as the 800 series.
Improved grinding quality
More stable Z2-axis grindability is achieved by matching the Z1 and Z2-axis grinding points. This reduces total thickness variation on the wafer as well as wafer to wafer thickness variation, contributing to more stable thinning quality.
Compatibility with existing models
Grinding wheels, dresser boards, spindles, and chuck tables for the existing 800 series are also compatible with DFG8540.
Easy operation
Installation of a touch screen and GUI (Graphical User Interface) provides improved operability. In addition, processing and equipment status are displayed on-screen and each operation
can be performed just by touching the icons. Thus, high operability during processing and maintenance is achieved.
